GA-96XX
HERCHY .
| Bozali: | |
|---|---|
| Motango: | |
Application: ebongi mpo na production ya ruban ya caoutchouc silicone conducteur ya chaleur, joint conducteur thermique mpe bongo na bongo.
Makambo ya ntina: makasi ya likolo, conductivité thermique ekoki kokoma na 0,5 -2w/mxk, koleka theauthentication ya RoHS mpe REACH.
Momekano : 1% ya agent curing (50% ya pâte ya DBPMH na siliconegum), 175°Cx5min x 15MPa.
| Ba paramètres ya produit | ||||||||
| Eloko | GA-9630 na nzela ya mokanda | GA-9640 na nzela ya mokanda | GA-9650 na nzela ya mokanda | GA-9660 na nzela ya mokanda | GA-9670 na nzela ya mokanda | GA-9680 na nzela ya mokanda | GA-9680B oyo ezali na kati | |
| Komonana | Gris | Moindo | ||||||
| Plasticité ya William | 160 | 180 | 200 | 220 | 240 | 270 | 270 | |
| Bokasi ya makasi (ShoreA) . | 30 | 40 | 50 | 60 | 70 | 76 | 79 | |
| Densité(g/cm3) Ezali na ba . | 2.1 | 2.13 | 2.15 | 2.2 | 2.25 | 2.04 | 2.35 | |
| Bokasi ya kokangama (MPa) . | 1 | 1.5 | 2 | 2 | 2.5 | 4.5 | 4.7 | |
| Elongation(%) ya . | 800 | 750 | 700 | 600 | 500 | 80 | 130 | |
| Bokasi ya kopasola (kN/m) . | 6 | 6 | 6 | 10 | 10 | 8 | 11.3 | |
| Coefficient ya conductivité thermique(W/MK) . | 0.8 | 0.8 | 0.8 | 0.9 | 0.9 | 0.8 | 0.9 | |